| 摘要 |
<P>PROBLEM TO BE SOLVED: To increase the mounting precision (loading precision) of an LED chip to an irradiated body (e.g., a photoreceptor of an image forming device). <P>SOLUTION: Position adjusting pins 1 (1a and 1b) are attached at least at two locations (e.g., both ends of a base) of the base 6 to which a substrate 4 is attached. At the same time, the LED chip 3 for which LED elements are aggregated is mounted on the substrate 4 in response to map data which is the imaging information of a CCD camera 24 by this manufacturing method for an LPH 11. First, the substrate 4 and the position adjusting pins 1 are attached to the base 6, and then, the images of the position adjusting pins 1a and 1b at least at two locations are picked up by the CCD camera 24. Then, the LED chip 3 is mounted on the substrate 4 in response to the map data. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
