| 摘要 |
PROBLEM TO BE SOLVED: To solve such a problem that, if a bonding pad is made narrow, solder cannot be supplied by solder paste printing, so that a low-cost solder mounting substrate is not provided. SOLUTION: In such a bonding pad of a semiconductor package substrate that has a center pad and corresponds to an IC chip, a bonding pattern with a wider pitch in one direction is formed so that a pattern to be wired roughly may become uniform with respect to lines of the bonding pads, and an extending pattern having a straight line and a larger pattern width is formed in the right-angle direction with respect to the lines of the bonding pad. Solder paste is printed uniform in shape in an extending part, and the solder is wetted and extended from the extending part, thus providing the semiconductor package substrate wherein the solder is formed in the bonding pad and its solder specification is inexpensive. COPYRIGHT: (C)2005,JPO&NCIPI
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