发明名称 Polymeric void-board for layers of bricks
摘要 An extruded polymeric void-board (12) is configured for placement between adjacent horizontal layers of bricks (14) to maintain an opening (22) in a lower layer of the bricks. The void-board (12) is formed as a planar element having parallel ribs (26) which extend from and generally transverse to a first side. The ribs (26) have a predetermined height to width ratio, a height that is less than a thickness (t24) of the planar element and are formed parallel to one another. A method for forming a bundle of bricks with the void-board is also disclosed. The board (12) is preferably of polypropylene, polyethylene and a fibrous or particulate filler. Weakened regions (36) may facilitate removal of vertical layers of bricks.
申请公布号 GB2412111(A) 申请公布日期 2005.09.21
申请号 GB20050004862 申请日期 2005.03.09
申请人 * ILLINOIS TOOL WORKS INC 发明人 TILAK R * VARMA;JOHN M * KRUELLE;WILLIAM J * WILLIAMS;DAVID J * DUKE
分类号 B65B27/02;B65B35/50;B65B61/20;B65D71/00;B65D85/46;(IPC1-7):B65D85/46 主分类号 B65B27/02
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