发明名称 |
Probe structures using clamped substrates with compliant interconnectors |
摘要 |
One embodiment of the present invention is a structure useful for testing circuits that includes: (a) a substrate having contactors on a first side and pads on a second side; (b) a card having pads on a first side; and (c) interconnectors that electrically connect the pads on the second side of the substrate with the pads on the card; wherein at least one of the interconnectors includes at least a portion that does not melt at temperatures in a range from about 183° C. to about 230° C., and the distance between the substrate and the card is determined by a dimension of the at least a portion.
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申请公布号 |
US6946859(B2) |
申请公布日期 |
2005.09.20 |
申请号 |
US20030418512 |
申请日期 |
2003.04.16 |
申请人 |
CELERITY RESEARCH, INC. |
发明人 |
KARAVAKIS KONSTANTINE N.;NGUYEN TOM T. |
分类号 |
G01R1/04;(IPC1-7):G01R31/02;H01R12/00 |
主分类号 |
G01R1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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