发明名称 |
Integrated passive components and package with posts |
摘要 |
A method and apparatus for an electronic component package of a passive component using wafer level processing;is provided. Posts are formed on the active side of the substrate of an electronic component. A conductive layer leads the contact areas of the electronic component to the tops of the posts. The conductive layer on the top of the posts acting as leads, attaching to traces on a printed circuit board.
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申请公布号 |
US6946734(B2) |
申请公布日期 |
2005.09.20 |
申请号 |
US20040783676 |
申请日期 |
2004.02.20 |
申请人 |
CHIPSCALE, INC. |
发明人 |
MARCOUX PHIL P.;YOUNG JAMES L.;CHEN CHANGSHENG |
分类号 |
H01L23/485;H01L27/08;(IPC1-7):H01L23/48;H01L23/52;H01L29/40;H01L23/29 |
主分类号 |
H01L23/485 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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