发明名称 |
Polishing pad for use in chemical/mechanical planarization of semiconductor wafers having a transparent window for end-point determination and method of making |
摘要 |
A porous polishing pad for use chemical/mechanical planarization of semiconductor wafers is provided with a transparent section formed in a section of the porous polishing pad by direct injection of a polymeric material into a modified portion of the pad. The modified section may be either a low density area, or may be created by removing a complete vertical section of the pad. The injected polymer forms an integral window with the pad by flowing into the matrix of the pad at the pad/window interface. No additional reinforcement is required to hold the window in place; however, adhesive and/or another impervious layer may be attached behind the window for additional support. In an alternative embodiment, a separate and distinct window-plug is inserted into a cutout section of the pad, and bonded to the pad by one or more binding film layers on the back, non-working surface of the pad.
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申请公布号 |
US6945846(B1) |
申请公布日期 |
2005.09.20 |
申请号 |
US20050091965 |
申请日期 |
2005.03.28 |
申请人 |
RAYTECH INNOVATIVE SOLUTIONS LLC |
发明人 |
PETROSKI ANGELA;COPPER RICHARD D.;FATHAUER PAUL;PERRY DAVID |
分类号 |
B24B37/04;B24D3/32;B24D11/00;(IPC1-7):B24B1/00 |
主分类号 |
B24B37/04 |
代理机构 |
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地址 |
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