发明名称 |
Surface acoustic wave device having connection between elements made via a conductor not on the piezoelectric substrate |
摘要 |
A surface acoustic wave device comprises: a plurality of surface acoustic wave elements provided on a piezoelectric substrate to be electrically isolated with each other, a substrate provided with a first conductor electrically connecting the plurality of surface acoustic wave elements, a second conductor electrically isolated to the first conductor and an external terminal, and a sealing member for protecting the substrate and the piezoelectric substrate. For the substrate, a package having a recess or an insulating substrate is used. The first conductor is electrically isolated to the external terminal, while the second conductor is electrically connected with the external terminal. The above-described structure provides a small-sized surface acoustic wave device with excellent-attenuation characteristics.
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申请公布号 |
US6946929(B2) |
申请公布日期 |
2005.09.20 |
申请号 |
US20030469077 |
申请日期 |
2003.08.26 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
IKEDA KAZUO;TAKADA MASAHIRO;NISHIMURA KAZUNORI |
分类号 |
H03H9/00;H03H9/02;H03H9/05;H03H9/25;H03H9/64;(IPC1-7):H03H9/64 |
主分类号 |
H03H9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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