| 摘要 |
A cooling device for cooling a microelectronic complex including a plurality of discrete functional modules. The cooling device includes a plurality of independent cooling modules, each cooling module in a thermal exchange relationship with a respective one of the plurality of discrete functional modules. During operation of the microelectronic complex, a cooling requirement of each discrete functional module is dynamically assessed, and the amount of cooling provided by each cooling module is adjusted on the basis of the assessed cooling requirements. Thus, the discrete functional modules are cooled independently from one another.
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