| 摘要 |
FIELD: machining semiconductor wafers. ^ SUBSTANCE: proposed machine tool designed for circular machining of semiconductor wafers to produce wafers having side surfaces of desired shape with minimal quantity of post-machining circular scratches and to execute great number of process operations without displacing wafers from one position to other has pair of supporting and driving rollers that function as supports for vertically disposed semiconductor wafers and are set in motion by means of drive belt connected to them. Machine tool also has two opposing movable wafer-machining units each incorporating first and second members designed for machining wafers when they are installed in first and second positions. Second design alternate of semiconductor wafer machine tool and self-aligning arbor fastening assembly is also proposed. ^ EFFECT: enlarged functional capabilities of machine tool, improved quality of post-machining side surfaces of wafers. ^ 22 cl, 17 dwg |
