发明名称 Electronic package with passive components
摘要 An electronic package with a passive component includes a circuit carrier, at least a passive component and an anisotropic conductive layer. The circuit carrier has at least a passive-component-pad set including multiple pads. The passive component has multiple electrodes placed over the corresponding pads of the passive-component-pad set. The anisotropic conductive layer is deposited between the electrodes and the pads.
申请公布号 US6946601(B1) 申请公布日期 2005.09.20
申请号 US20040711675 申请日期 2004.09.30
申请人 VIA TECHNOLOGIES INC. 发明人 LEE I-TSENG;TSENG JEN-TE
分类号 H01L21/60;H01L23/28;H01L25/16;H05K3/28;H05K3/32;H05K3/34;H05K5/06;(IPC1-7):H01L23/28 主分类号 H01L21/60
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