发明名称 |
Method and device for removing particles on semiconductor wafers |
摘要 |
The method for removing particles that adhere to the surface of semiconductor wafers is constituted so as to sequentially carry out a first cleaning process in which semiconductor wafers 100 are cleaned for a prescribed time in cleaning tank 104 containing a first cleaning solution consisting of ozone water, and, after said first cleaning process, a second cleaning process in which said semiconductor wafers 100 are cleaned for a prescribed time in cleaning tank 106 containing a second cleaning solution consisting of hydrogen water.
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申请公布号 |
US6946036(B2) |
申请公布日期 |
2005.09.20 |
申请号 |
US20020085753 |
申请日期 |
2002.02.28 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
TSUGA TOSHIHITO;FUBE MINORU;NAKAYAMA KAZUTAKA |
分类号 |
B08B3/08;B08B3/12;H01L21/00;H01L21/304;H01L21/308;(IPC1-7):B08B3/00 |
主分类号 |
B08B3/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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