发明名称 |
Process for electroplating metal into microscopic recessed features |
摘要 |
Several techniques are described for reducing or mitigating the formation of seams and/or voids in electroplating the interior regions of microscopic recessed features. Cathodic polarization is used to mitigate the deleterious effects of introducing a substrate plated with a seed layer into an electroplating solution. Also described are diffusion-controlled electroplating techniques to provide for bottom-up filling of trenches and vias, avoiding thereby sidewalls growing together to create seams/voids. A preliminary plating step is also described that plates a thin film of conductor on the interior surfaces of features leading to adequate electrical conductivity to the feature bottom, facilitating bottom-up filling. |
申请公布号 |
US6946065(B1) |
申请公布日期 |
2005.09.20 |
申请号 |
US20000716016 |
申请日期 |
2000.11.16 |
申请人 |
NOVELLUS SYSTEMS, INC. |
发明人 |
MAYER STEVEN T.;BHASKARAN VIJAY;PATTON EVAN E.;JACKSON ROBERT L.;REID JONATHAN |
分类号 |
C25D3/38;C25D5/18;H05K3/42;(IPC1-7):C25D5/18;H01L21/768 |
主分类号 |
C25D3/38 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|