| 摘要 |
PROBLEM TO BE SOLVED: To provide a cleaning method which has a high washing performance using little chemical and has extremely low reattachment of foreign matters, etc. to a substrate in cleaning the substrate to be used for semiconductor manufacturing such as a silicon wafer and a photo mask, and to provide a spin cleaning apparatus. SOLUTION: The cleaning method for the substrate for a semiconductor using the spin cleaning apparatus for cleaning and drying the substrate to be used for semiconductor manufacturing comprises a first process of dropping a small amount of a room temperature cleaning liquid, on the surface of the substrate being rotated at a low speed to expand the cleaning liquid evenly on the surface of the substrate; a second process wherein, while rotating the substrate at a low speed, with the cleaning liquid applied on the surface of the substrate, high temperature superpure water is supplied to the rear face of the substrate, and the substrate and the cleaning liquid are heated at a high temperature and are kept in such a condition for a prescribed period of time to the surface of the substrate; and a third process wherein, after the cleaning treatment for the prescribed period of time, superpure water is supplied to the substrate from above the substrate to wash away the cleaning liquid. COPYRIGHT: (C)2005,JPO&NCIPI
|
