发明名称 DUSTPROOF STRUCTURE OF SUBSTRATE MODULE
摘要 PROBLEM TO BE SOLVED: To provide the dustproof structure of a substrate module which allows a work of covering a substrate connector to be easily done and has no chance of falling-off of an object for covering the substrate connector. SOLUTION: The entire surface of a substrate 5 is covered by a surface case 9 having a cover 8. Due to this structure, even if there are a plurality of substrate connectors 6, the work of covering the substrate connectors 6 can be done by a one-time job and therefore is easily done. When connecting a harness connector 14 to the substrate connector 6 which needs to be connected by the harness connector 14, a top 11 of the cover 8 is split from a fragile point 12 and opened just by pushing the harness connector 14 against the cover 8, and therefore the harness connector 14 can be easily connected to the substrate connector 6. At that time, the top 11 of the cover 8 is just opened, but not separated from the cover 8, resulting in being prevented from falling off. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005251787(A) 申请公布日期 2005.09.15
申请号 JP20040056160 申请日期 2004.03.01
申请人 CALSONIC KANSEI CORP 发明人 UCHIDA TAKASHI;SUZUKI HITOSHI
分类号 H05K7/00;H01R13/52;H05K5/00;H05K5/02;H05K5/03;(IPC1-7):H05K5/02 主分类号 H05K7/00
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