发明名称 SURFACE-TREATED COPPER FOIL
摘要 PROBLEM TO BE SOLVED: To provide a surface-treated copper foil which has a low hygroscopicity and can be laminated with a liquid crystal polymer film excellent in heat resistance to form a composite material for a substrate which has a large peel strength and can be finely patterned. SOLUTION: The surface-treated copper foil is a copper foil having a roughened surface which is achieved by depositing roughening particles on the copper foil and has a surface roughness Rz of 1.5-4.0μm and a brightness value of≤30. A projection formed with the roughening particles has a height of 1-5μm and is preferably uniformly distributed at a density of 6-35 projections within an observed section of 25μm. Preferably, the maximum width of each projection is≥0.01μm but no larger than twice the length calculated by dividing 25μm by the number of projections found within the 25μm range. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005248323(A) 申请公布日期 2005.09.15
申请号 JP20050012440 申请日期 2005.01.20
申请人 FURUKAWA CIRCUIT FOIL KK 发明人 SUZUKI YUJI
分类号 H05K1/09;C25D7/06;H05K3/38;(IPC1-7):C25D7/06 主分类号 H05K1/09
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