Copper-based metal polishing solution and method for manufacturing semiconductor device

摘要

Disclosed is a copper-based metal polishing solution which hardly dissolves a Cu film or a Cu alloy film when the film is dipped into the solution, and has a dissolution velocity during polishing several times higher than that during dipping. This copper-based metal polishing solution contains at least one acid selected from aminoacetic acid and aminosulfuric acid, an oxidizer, and water.