发明名称 Dynamic random access memory cell and method for fabricating the same
摘要 A DRAM cell and a method for fabricating the same are provided. The method includes: forming a trench in a substrate; forming a first capacitor dielectric layer on the surface of the trench; forming a conducting layer inside the trench; forming a second capacitor dielectric layer on the surface of the substrate and on the conducting layer, wherein the substrate around the first and second capacitor dielectric layers serves as a bottom electrode; forming a protruding electrode on the substrate, the protruding electrode being on the substrate around the trench and covering a junction between the trench and the substrate; and electrically connecting the protruding electrode and the conducting layer, the conducting layer and the protruding electrode being an upper electrode.
申请公布号 US2005202628(A1) 申请公布日期 2005.09.15
申请号 US20050122655 申请日期 2005.05.04
申请人 LIN YUNG-CHANG;LIANG CHIA-WEN;WANG CHUAN-FU 发明人 LIN YUNG-CHANG;LIANG CHIA-WEN;WANG CHUAN-FU
分类号 H01L21/336;H01L21/8242;H01L27/108;(IPC1-7):H01L21/824 主分类号 H01L21/336
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