发明名称 |
VERFAHREN ZUM KLEBEN VON SUBSTRATEN UNTER VERWENDUNG EINER LICHTAKTIVIERBAREN KLEBSTOFFFOLIE |
摘要 |
<p>The present invention provides a method of connecting substrates using light activatable film while preventing the deterioration of the substrate in the process. The present invention also provides a method for connecting circuits which includes irradiating a light activatable adhesive film, contacting the first surface of the activated anisotropically conductive adhesive film with the circuit on a first substrate, contacting the circuit on a second substrate with the second surface of said activated anisotropically conductive adhesive film, and compression bonding these substrates.</p> |
申请公布号 |
DE60205456(D1) |
申请公布日期 |
2005.09.15 |
申请号 |
DE2002605456 |
申请日期 |
2002.01.29 |
申请人 |
3M INNOVATIVE PROPERTIES CO., SAINT PAUL |
发明人 |
YAMAGUCHI, HIROAKI;KITAMURA, TETSU |
分类号 |
B32B7/12;B32B27/08;C08G59/18;C08J5/12;C08L63/00;C09J5/00;C09J5/06;C09J7/00;C09J9/02;C09J163/00;C09J201/00;H01L21/60;H05K3/32;(IPC1-7):C09J5/06 |
主分类号 |
B32B7/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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