| 摘要 |
<P>PROBLEM TO BE SOLVED: To surely joint a pixel substrate 18 and a sealing substrate 10 with high precision. <P>SOLUTION: A pattern of a metal solder layer is formed on the sealing substrate by photolithography patterning, and the pixel substrate 18 and the sealing substrate 10 are jointed by superposing the pixel substrate 18 on the sealing substrate 10 and irradiating a laser beam on the solder layer 16. As it is jointed by the metal solder layer 16, water permeation into an inside space can be reduced. Further, the solder layer 16 can be formed in high precision by the patterning. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
