| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having high resolution, high sensitivity, excellent pattern dimension controllability, high heat resistance and low hygroscopicity, and to provide a cured object of the composition. <P>SOLUTION: The negative photosensitive resin composition comprises (A) an alkali-soluble phenolic resin, (B) a polyamide resin, (C) a photoacid generator, (D) a polyfunctional methylol compound and (E) a solvent, is adaptable to both high temperature curing and low temperature curing, and ensures good chemical resistance of an obtained film and good adhesion of the film to a substrate. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
