| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing device easy to polish a polishing object with high accuracy by suppressing gas flow caused by disturbance of a liquid level of polishing liquid. SOLUTION: In this polishing device, the polishing object 16 is arranged in the polishing liquid 12 and the polishing object 16 is polished by injecting gas 17 from an injection nozzle 20 toward the polishing object 16. The polishing device is provided with a coated member 22 to cover the liquid surface 12a of the polishing liquid 12 around the injection nozzle 20. The coated member 22 is formed so that the gas 17 rising to the coated member 22 side by being injected in the polishing liquid 12 from the injection nozzle 20 may pass to an outside air 29 side on the coated member 22. COPYRIGHT: (C)2005,JPO&NCIPI |
