发明名称 PLASMA TREATMENT DEVICE AND ITS MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a plasma treatment device capable of preventing arc from being generated between an insulating member and a conductive member. <P>SOLUTION: The plasma treatment device M blows out treatment gas passed into a plasma space 30a between electrodes 31, 32 toward a work W arranged below (outside the space 30a). The insulating member 40 is arranged at an underside (an opposite side of the work W), and underneath the insulating member 40, the conductive member 42 is arranged with a gap 40b in between in an electrically grounded state. A dielectric constant and a thickness of the insulating member 40 are so set that a voltage impressed on the gap 40b be smaller than spark voltage. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005251719(A) 申请公布日期 2005.09.15
申请号 JP20040142333 申请日期 2004.05.12
申请人 SEKISUI CHEM CO LTD 发明人 UEHARA TAKESHI
分类号 H05H1/24;B08B7/00;H01L21/205;H01L21/304;H01L21/3065 主分类号 H05H1/24
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