| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of semiconductor device which can set up connection between layers, without giving damages to the layers in the lower-layer side. SOLUTION: The manufacturing method of semiconductor device comprises the steps of forming conductive members Ms, Md to the predetermined positions of a semiconductor film 11; forming an insulating film 12 over the entire surface of a substrate 10, except for the conductive members Ms, Md; and forming on the insulating film 12 a conductive film 13, which is electrically connected with the semiconductor film 11 via the conductive members Ms, Md. COPYRIGHT: (C)2005,JPO&NCIPI
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