| 摘要 |
PROBLEM TO BE SOLVED: To eliminate a problem such as re-adhesion of mists of a chemical solution to a substrate and also to eliminate leaving of unevenness of the chemical solution in the substrate processing apparatus used for processes using chemical solutions. SOLUTION: The substrate processing apparatus is provided with a plurality of chambers 1 to 7 for sequentially conducting the processes while the substrate is being shifted. A plurality of chambers 1 to 7 include chemical solution processing chambers 2, 3 for conducting solution processes to the substrate and water cleaning chambers 5, 6 for conducting water cleaning of the substrate after the processes by the chemical solutions. Any of a plurality of chambers is provided with a spinning apparatus 25 for conducting spinning process to the substrate before the water cleaning after the processes by the chemical solutions. COPYRIGHT: (C)2005,JPO&NCIPI
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