发明名称 METHOD FOR FORMING SILICON NITRIDE FILM
摘要 PROBLEM TO BE SOLVED: To provide a method for forming a silicon nitride film that can keep high film quality and is superior in coating capability to a steps or the like. SOLUTION: A first gas containing silicon and nitrogen and a second gas containing nitrogen and oxygen are made to act on a heated catalyst in a pressure-reduced atmosphere, thus forming the silicon nitride film. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005251877(A) 申请公布日期 2005.09.15
申请号 JP20040058214 申请日期 2004.03.02
申请人 SEMICONDUCTOR LEADING EDGE TECHNOLOGIES INC;ULVAC JAPAN LTD 发明人 SAITO TAKESHI;ITO HIROMI;KITAZOE MAKIKO
分类号 H01L21/318;H01L21/4763;H01L29/78;(IPC1-7):H01L21/318 主分类号 H01L21/318
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