| 摘要 |
PROBLEM TO BE SOLVED: To provide a both-face printed wiring board which enables a high density wiring and has high bending properties in case of a flexible printed wiring board. SOLUTION: A method for manufacturing a circuit board comprises the steps of forming a through hole in a substrate in which a metal layer is formed on both faces of an insulating layer, forming a covered layer on one face side of the substrate, performing through hole plating in the through hole to make both the metal layers conductive, and removing the covered layer. Further, the through hole plating step has the step of forming plating only in the metal layer on an opposing face to the covered layer and an inner wall of the through hole. COPYRIGHT: (C)2005,JPO&NCIPI
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