Gluing system for fastening transponder chip to substrate uses thick layer of electrically conducting glue with matrix loaded with conducting particles forming bridges between electrodes

摘要

The chip (10) may be a transponder chip or an RFID (Radio Frequency Identification) chip. It has electrodes (12,14,16) facing corresponding electrodes (22,24,26) on the substrate (20). A thick layer (D) of plastics resin glue (30) is formed between the chip and the substrate. The glue matrix contains electrically conducting nanoparticles (32) of gold, silver, nickel, or copper. The electrodes project from the surfaces of the chip and substrate and, as the chip is pressed onto the substrate, thin layers (d) are formed between the electrodes, electrically bridged by the conducting particles, to give an effective contact between the electrodes.