| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive ceramic composition capable of reducing stress due to hardening shrinkage during photolithographic processing and firing by a ring-opening polymerizable compound, and to provide a photosensitive ceramic substrate ensuring reduced warpage and excellent dimensional stability while having alkali developability. SOLUTION: In the photosensitive ceramic composition using a photosensitive organic component and an inorganic powder, the photosensitive organic component includes the ring-opening polymerizable compound. COPYRIGHT: (C)2005,JPO&NCIPI |
