SEMICONDUCTOR ASSEMBLY AND TEST METHOD

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor package assembly having an improved contact structure.

SOLUTION: A semiconductor assembly 611 includes; a substrate 612 made of an insulating material which has conductive contact pads formed on its first surface and second surface; a plurality of semiconductor devices 612 having contact pads opposite to the contact pads on the first and second surfaces of the substrate 612; a spring contact structure 626 for electrically interconnecting the contact pads of the semiconductor devices 612 and the contact pads held by the substrate 612 and for supporting the semiconductor devices at positions spaced from the surface of the substrate 612 such that the semiconductor devices 612 are placed on the first and second planes in parallel each other which are both sides of the substrate 612; and a contact means 616 held by the substrate 612 for forming an electrical contact to the semiconductor devices 612 through the contact structure 626.

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