发明名称 FLAME RETARDANT ADHESIVE COMPOSITION, AND ADHESIVE SHEET, COVER LAY FILM AND FLEXIBLE COPPER CLAD LAMINATE PLATE BY USING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an adhesive composition of which cured material obtained by curing is excellent in flame retardant property and electric characteristics (migration resistance) and without containing a halogen, and an adhesive sheet, cover lay film and flexible copper clad laminate plate by using the same. <P>SOLUTION: This flame retardant adhesive composition contains (A) a non-halogen-based epoxy resin, (B) a thermoplastic resin and/or synthetic rubber, (C) a curing agent, (D) a curing accelerator and (E) a phosphorus-containing filler. The adhesive sheet, cover lay film and flexible copper clad laminate plate by using the same are also provided. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2005248048(A) 申请公布日期 2005.09.15
申请号 JP20040061670 申请日期 2004.03.05
申请人 SHIN ETSU CHEM CO LTD 发明人 NAKANISHI NOBORU;ARAI HITOSHI;AIZAWA MICHIO;AMANO TADASHI
分类号 C09J7/00;B32B15/08;B32B27/38;C09D5/26;C09J7/02;C09J11/02;C09J163/00;C09J167/00;C09J179/08;C09K21/14;H05K1/03;H05K3/28;H05K3/38;(IPC1-7):C09J163/00 主分类号 C09J7/00
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