| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve the long mounting reliability of a semiconductor device to improve the reliability of an electronic apparatus. <P>SOLUTION: The semiconductor device 1 has a wiring board 2 having a mutually opposed main and back surfaces, a plurality of electrode pads 7b (8b, 9b) disposed on the back surface, and an insulation film 11 laid on the back surface; and a semiconductor chip 15 mounted on the main surface of the wiring board 2. The plurality of electrode pads 7b (8b, 9b) include a first smaller electrode pad 8b exposed from a first opening 11a provided in the insulation film 11 then the opening 11a, and a second electrode pad 7b (9b) exposed from a second opening 11b provided in the film 11 with its peripheral edge covered with the film 11. The second electrode pad 7b (9b) is disposed at the farthest position at least from the semiconductor chip 15. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
