| 摘要 |
To provide an optical element wafer that can lower the cost of a burn-in step for the optical element wafer. An optical element wafer in accordance with the present invention includes a substrate, a plurality of optical elements formed above the substrate, and a burn-in electrode formed above the substrate, in an area different from an element forming area where the optical elements are formed, wherein the optical element includes a first semiconductor layer formed above the substrate, an active layer formed above the first semiconductor layer, a second semiconductor layer formed above the active layer, a first electrode that is electrically connected to the first semiconductor layer, and a second electrode that is electrically connected to the second semiconductor layer. Each of the optical elements shares the first semiconductor layer, and the burn-in electrode is electrically connected to the first semiconductor layer.
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