| 发明名称 |
Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board |
| 摘要 |
The invention relates to an adhesion assisting agent-bearing metal foil comprising a layer of an adhesion assisting agent containing an epoxy resin as an indispensable component on a metal, wherein the adhesion assisting agent layer has a thickness of 0.1 to 10 mum. The invention also relates to a printed wiring board being a multilayer wiring board having a plurality of layers, wherein an adhesion assisting agent layer is formed between insulating layers.
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| 申请公布号 |
US2005202261(A1) |
申请公布日期 |
2005.09.15 |
| 申请号 |
US20050044533 |
申请日期 |
2005.01.28 |
| 申请人 |
TAKAI KENJI;MORIIKE NORIO;KAMIYAMA KENICHI;WATANABE TAKAKO;TAKANEZAWA SHIN;MORITA KOJI;MASUDA KATSUYUKI;HASEGAWA KIYOSHI |
发明人 |
TAKAI KENJI;MORIIKE NORIO;KAMIYAMA KENICHI;WATANABE TAKAKO;TAKANEZAWA SHIN;MORITA KOJI;MASUDA KATSUYUKI;HASEGAWA KIYOSHI |
| 分类号 |
B32B3/00;H05K1/00;H05K3/00;H05K3/10;H05K3/28;H05K3/38;H05K3/46;(IPC1-7):B32B3/00 |
主分类号 |
B32B3/00 |
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