发明名称 SEMICONDUCTIVE POLYIMIDE BELT
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductive belt capable of reducing dimensional changes due to humidity at the time of using it for an intermediate transfer belt or the like and having excellent durability. <P>SOLUTION: In the semiconductive polyimide belt consisting of polyimide resin containing carbon black, a coefficient of linear expansion of moisture absorption is &le;30 ppm/%RH and tearing strength is &ge;3.5 N/mm. The polyimide resin is obtained by polymerizing tetracarbonic acid bianhydride or its derivative and diamine compound and imidizing the polymerized component and the diamine compound is preferably selected from a group of compounds shown by the structural formula (I) (in the formula, X indicates the same or respective different alkyl groups having 1 to 5 carbons or its alkyl halide) and structural formulas (II), (III). <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005250139(A) 申请公布日期 2005.09.15
申请号 JP20040060857 申请日期 2004.03.04
申请人 NITTO DENKO CORP 发明人 WATANABE YOSHINOBU;MATSUSHITA KIICHIRO;DOMOTO TADANORI
分类号 G03G21/00;G03G15/00;G03G15/16 主分类号 G03G21/00
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