发明名称 COATING METHOD AND COATING APPARATUS
摘要 PROBLEM TO BE SOLVED: To carry out coating treatment of high in-plane uniformity to a substrate when a coating liquid produced by dissolving coating film forming components in a solvent is applied onto a substrate surface. SOLUTION: A coating liquid nozzle is opposed to the substrate surface horizontally held by a substrate holding section. While ejecting the coating liquid from an ejection port, the coating liquid nozzle and the substrate are relatively moved back and forth, left and right to linearly apply the coating liquid onto the substrate surface so as to be put in order back and forth in a so-called way of making one stroke with a pen. Then by forming an air current in a direction intersecting the longitudinal direction of linear coating liquid arranged on the substrate surface, flowing is produced in the coating liquid to spread the coating liquid on the substrate surface. Thereby adjoining resists can be joined to each other and further can be fitted to each other and consequently a coating liquid film of high in-plane uniformity can be formed on the substrate surface. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005246312(A) 申请公布日期 2005.09.15
申请号 JP20040062651 申请日期 2004.03.05
申请人 TOKYO ELECTRON LTD 发明人 SUGIMOTO SHINICHI
分类号 B05D3/04;B05C5/00;B05C11/06;B05D1/26;(IPC1-7):B05D3/04 主分类号 B05D3/04
代理机构 代理人
主权项
地址