发明名称 Equipment and methods for producing continuous metallized thermoformable EMI shielding material
摘要 The present invention provides in-line equipment and methods for manufacturing an EMI/RFI shield that is integrated formed in a formable sheet. The EMI/RFI shield may comprise a shaped thermoform shell that has one or more conductive layers applied to one or more surfaces. The EMI/RFI shield may be integrally formed with the formable sheet via attachment tabs that are positioned along one or more edges of the EMI/RFI shield.
申请公布号 US2005202723(A1) 申请公布日期 2005.09.15
申请号 US20050061857 申请日期 2005.02.17
申请人 SHIELDING FOR ELECTRONICS, INC. 发明人 ARNOLD ROCKY R.;ZARGANIS JOHN C.
分类号 H05K9/00;(IPC1-7):H01R13/648 主分类号 H05K9/00
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