发明名称 |
Equipment and methods for producing continuous metallized thermoformable EMI shielding material |
摘要 |
The present invention provides in-line equipment and methods for manufacturing an EMI/RFI shield that is integrated formed in a formable sheet. The EMI/RFI shield may comprise a shaped thermoform shell that has one or more conductive layers applied to one or more surfaces. The EMI/RFI shield may be integrally formed with the formable sheet via attachment tabs that are positioned along one or more edges of the EMI/RFI shield.
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申请公布号 |
US2005202723(A1) |
申请公布日期 |
2005.09.15 |
申请号 |
US20050061857 |
申请日期 |
2005.02.17 |
申请人 |
SHIELDING FOR ELECTRONICS, INC. |
发明人 |
ARNOLD ROCKY R.;ZARGANIS JOHN C. |
分类号 |
H05K9/00;(IPC1-7):H01R13/648 |
主分类号 |
H05K9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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