发明名称 COMPONENT WITH ENCAPSULATION SUITABLE FOR WLP AND PRODUCTION METHOD
摘要 The invention relates to an electrical component, with a cover and in particular with a circuit board, for encapsulation, with electrical connections made from a conducting glue. The above can be injected into the construction through a channel system, whereby the electrical short-circuiting of all connections produced can be broken again by means of a suitably executed cutting step in the separation of the components.
申请公布号 WO2005086233(A2) 申请公布日期 2005.09.15
申请号 WO2005EP00327 申请日期 2005.01.14
申请人 EPCOS AG;PAHL, WOLFGANG 发明人 PAHL, WOLFGANG
分类号 H01L23/31;H01L23/498;H01L23/538;H05K1/18;H05K3/00;H05K3/40;H05K3/46 主分类号 H01L23/31
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