发明名称 OPTICAL SEMICONDUCTOR DEVICE, OPTICAL INTERCONNECTION SYSTEM, AND OPTICAL WIRING MODULE
摘要 PROBLEM TO BE SOLVED: To provide an optical semiconductor device capable of packaging a light emitting device or a light receiving device and a fiber (optical fiber) highly precisely in a short time. SOLUTION: On a surface emitting laser substrate (2) on which surface emitting laser diodes (1) of a light emitting device are formed, ring-shaped projections (3a) are provided in alignment as correctly as the surface emitting laser diodes are formed. Thus, an optical fiber (5) can be connected with sufficient positional accuracy by locating the ring-shaped projection (3a) around the surface emitting laser diode (1), and utilizing a self-alignment function of a fixing material (11). COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005250003(A) 申请公布日期 2005.09.15
申请号 JP20040058771 申请日期 2004.03.03
申请人 RICOH CO LTD 发明人 HIROI MASAKI
分类号 G02B6/42;H01S5/022;H01S5/42;(IPC1-7):G02B6/42 主分类号 G02B6/42
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