SOLDER PASTE

摘要

A solder paste which comprises a first solder alloy, a second solder alloy and a flux, wherein the first and second solder alloys are obtained by dividing a Sn-Ag-In based lead-free solder alloy so as for the two types of alloy to have a difference in the peak temperature in the differential thermal analysis of 10°C or more, and the solder paste is prepared by mixing the first and second alloys and the flux. The solder paste allows the solution of the problems associated with the use of conventional lead-free solder pastes that a solder paste using a powder of a Sn-Ag based alloy, a Sn-Cu alloy or the like is apt to damage an electronic part by heat, owing to a high melting point of the alloy, and that a Sn-Ag-In based alloy having a low melting point causes chip rising frequently and thus is difficult to use.