| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board in which a surface unevenness is small and which is suitable for fine wiring nature. SOLUTION: The multilayer wiring board includes an insulating resin with a support having an insulating resin layer covered on a support and manufactured by laminating the insulating resin so as to be opposed to the wiring formed on the board or the wiring board. As the insulating resin layer, a thermosetting insulating resin composition which has a melting viscosity at 40°C of 8,000-50,000 Pas and a lowest melting viscosity of 10-400 Pas is used. The laminating step is performed at a temperature lower by 10°C than the temperature showing the lowest melting viscosity of the insulating resin layer. A method of manufacturing the same is provided. COPYRIGHT: (C)2005,JPO&NCIPI |
