Semiconductor package with heat sink and method for fabricating the same and stiffener

摘要

A semiconductor package with a heat sink, a method for fabricating the same and a stiffener for the semiconductor package are proposed. At least one chip and the stiffener surrounding the chip are mounted on a substrate, and the heat sink is respectively attached to a non-active surface of the chip and the stiffener. A plurality of penetrating openings are formed on the stiffener, and an adhesive is filled in the penetrating openings to enhance the bonding strength of the heat sink and the stiffener, thereby inhibiting the heat sink and the stiffener from coming off.