发明名称 Method and structure for non-single-polycrystalline capacitor in an integrated circuit
摘要 A method of forming a non-single-crystalline capacitor in an integrated circuit. It includes the steps of forming a first non-single-crystalline layer on a gate dielectric layer of a substrate of an integrated circuit. Next, a capacitor dielectric layer is formed on the first non-single-crystalline layer, and a second non-single-crystalline layer is formed on the capacitor dielectric layer. Portions of the second non-single-crystalline layer are removed to define a top plate of the capacitor. Portions of the capacitor dielectric layer are removed to define a dielectric of the capacitor. Also, portions of the first non-single-crystalline layer are removed to define the bottom plate of the capacitor.
申请公布号 US2005202629(A1) 申请公布日期 2005.09.15
申请号 US20040798559 申请日期 2004.03.12
申请人 INTERSIL AMERICAS INC. 发明人 WOODBURY DUSTIN A.;KINZIG ROBERT J.;BEASOM JAMES D.;VALADE TIMOTHY A.;HEMMENWAY DONALD F.;ELSHOT KITTY
分类号 H01L21/20;(IPC1-7):H01L21/20 主分类号 H01L21/20
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