Semiconductor apparatus and method for manufacturing semiconductor apparatus

摘要

The semiconductor apparatus includes an upper semiconductor chip having an upper external terminal and a lower semiconductor chip having a lower bump for electrically connecting a lower external terminal and the upper external terminal. The circuit surfaces of the upper semiconductor chip and the lower semiconductor chip are electrically connected to each other via the bump. A low impedance line having lower impedance than the internal line of the lower semiconductor chip is formed on top of the lower semiconductor chip for electrically connecting the lower external terminal and the bump.