发明名称 |
METHOD OF FABRICATING ELECTRONIC INTERCONNECT DEVICES USING DIRECT IMAGING OF DIELECTRIC COMPOSITE MATERIAL |
摘要 |
An improved method of fabricating an electronic interconnect device using direct imaging of dielectric composite material by the inclusion of a conducting material in the composite material that becomes non-conducting through exposure to electromagnetic radiation. The conducting material generally comprises single-wall carbon nanotubes. |
申请公布号 |
WO2005084183(A2) |
申请公布日期 |
2005.09.15 |
申请号 |
WO2004US04748 |
申请日期 |
2004.02.17 |
申请人 |
MACDERMID, INCORPORATED |
发明人 |
CULLEN, DONALD, P. |
分类号 |
H01L51/30;H01L51/40;H05K1/03;H05K3/02;H05K3/10 |
主分类号 |
H01L51/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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