| 摘要 |
PROBLEM TO BE SOLVED: To provide a transfer molding method capable of manufacturing a semiconductor device having high reliability and a high quality and excellent in economical efficiency and environmental countermeasures. SOLUTION: A plurality of kinds of granular or powdery molding resins 4 and 5 are prepared as molding resins and the respective resins 4 and 5 are individually stored in a plurality of hoppers 12. The molding resins 4 and 5 are successively supplied to the pot 6 of a mold C from the respective hoppers 12 so as not to be mixed with each other and fed under pressure by a plunger 11 to be molded. COPYRIGHT: (C)2005,JPO&NCIPI
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