| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an IC chip mount structure capable of reducing its circuit substrate in size and the costs, of improving connection reliability and yield in a process of substrate assembling, and of reducing the total cost in a control unit for a vehicle capable of being installed in an engine room, for example, an engine control unit. <P>SOLUTION: The control unit comprises multiple IC chip packages 11, 12, and 13 each composed by mounting an IC chip electrically connected thereto and including an interposer composed of a heat proof multilayer substrate 5 and solder bump the one side of which is electrically connected to the interposer and mounted thereon, and a heat-generating power system IC chip is mounted in one of or the multiple IC chip packages 11, 12, and 13 separately from another non-power system IC chip and these IC chip packages (including a heat dissipating means) 11, 12, and 13 are arranged in a hermetically sealed case with the other side of the solder bump being electrically connected to and chip-mounted on the conduction pattern of the circuit substrate. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
