发明名称
摘要 An apparatus in one example includes a compliant component for supporting an electrical interface component that serves to electrically and mechanically couple a die with a separate layer. In one example, the compliant component, upon relative movement between the die and the separate layer, serves to promote a decrease in stress in one or more of the die and the separate layer. The apparatus in another example includes a compliant component for supporting an electrical interface component that serves to create an electrical connection between a die and a separate layer. The compliant component, upon relative movement between the die and the separate layer, serves to promote maintenance of the electrical connection.
申请公布号 JP2005527980(A) 申请公布日期 2005.09.15
申请号 JP20040508407 申请日期 2003.05.21
申请人 发明人
分类号 H05K1/18;H01L21/60;H01L23/498;(IPC1-7):H01L21/60 主分类号 H05K1/18
代理机构 代理人
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