发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To improve maintenance work efficiency and operation coefficient of a substrate processing apparatus by easily removing a reaction byproduct deposited on an exhaust pipe and thereby remarkably alleviating the maintenance work. SOLUTION: The manufacturing method of semiconductor device is provided with a function to remove a deposition 48 adhered to the pipe wall by providing a deposition removing body 43 which can shift within a pipe 27, and by shifting the deposition removing body within the pipe. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005251988(A) 申请公布日期 2005.09.15
申请号 JP20040060547 申请日期 2004.03.04
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 TAKEBAYASHI MOTONARI
分类号 C23C16/44;H01L21/22;H01L21/31;H01L21/324;(IPC1-7):H01L21/31 主分类号 C23C16/44
代理机构 代理人
主权项
地址
您可能感兴趣的专利