发明名称 |
SUBSTRATE PROCESSING APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To improve maintenance work efficiency and operation coefficient of a substrate processing apparatus by easily removing a reaction byproduct deposited on an exhaust pipe and thereby remarkably alleviating the maintenance work. SOLUTION: The manufacturing method of semiconductor device is provided with a function to remove a deposition 48 adhered to the pipe wall by providing a deposition removing body 43 which can shift within a pipe 27, and by shifting the deposition removing body within the pipe. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2005251988(A) |
申请公布日期 |
2005.09.15 |
申请号 |
JP20040060547 |
申请日期 |
2004.03.04 |
申请人 |
HITACHI KOKUSAI ELECTRIC INC |
发明人 |
TAKEBAYASHI MOTONARI |
分类号 |
C23C16/44;H01L21/22;H01L21/31;H01L21/324;(IPC1-7):H01L21/31 |
主分类号 |
C23C16/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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