发明名称 RESIN OR RESIN COMPOSITION FOR MOLDED PRODUCT
摘要 PROBLEM TO BE SOLVED: To provide a resin or a resin composition which gives a molded product having good initial dielectric properties and hardly undergoes changes in dielectric properties, particularly a dielectric dissipation factor in a high frequency zone of at least 1 MHz, particularly at least 1 GHz when left at a high temperature. SOLUTION: The resin or the resin composition comprises a polymer material and, incorporated therewith, triethylenediamine and/or hexamethylenetetramine. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005248103(A) 申请公布日期 2005.09.15
申请号 JP20040063631 申请日期 2004.03.08
申请人 SHOWA HIGHPOLYMER CO LTD 发明人 YOSHIDA HARUO;NISHIGUCHI SHOJI;KOBUNE HIROTAKA
分类号 C08L101/00;C08K5/17;C08K5/3477;C08L71/12;C08L79/08;C08L101/02;(IPC1-7):C08L101/00;C08K5/347 主分类号 C08L101/00
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