METHOD OF CUTTING WAFER MANUFACTURED SEMICONDUCTOR LIGHT EMITTING DEVICE,申请号KR20040016930-传众专利搜索

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发明名称	METHOD OF CUTTING WAFER MANUFACTURED SEMICONDUCTOR LIGHT EMITTING DEVICE
摘要
申请公布号	KR20050091467(A)	申请公布日期	2005.09.15
申请号	KR20040016930	申请日期	2004.03.12
申请人	LG ELECTRONICS INC.	发明人	YI, JEONG HOON
分类号	H01L21/78;(IPC1-7):H01L21/78	主分类号	H01L21/78
代理机构		代理人
主权项
地址

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